TES, the new generation of ion & electron sources.

The smallest microwave plasma source on the market !

Choose the TES model that best suits your needs

Product vs Processes
Neutralization
Electron chemistry
High power
electron beam
Etching
Sputtering
Surface activation
Beam line
Accelerator
Mass spectrometry
Figuring
Surface modification
TES-40
TES-40-electrons x x
TES-40-ions broad beam x x x x
TES-40-ions high brightness x x x
TES-63
TES-63-electrons x x
TES-63-ions x x x x
TES-63-ions high brightness x x x x
TES-63-ions scanner x x x
TES-100
TES-100-electrons x x
TES-100-ions x x x x
TES-100-ions high stability x x

COMPARATIVE CHARACTERISTICS

TES-40 TES-63 TES-100
Discharge ECR filament free ECR filament free ECR filament free
Gas H₂, He, N₂, O₂, noble gas, molecular gas H₂, He, N₂, O₂, noble gas, molecular gas H₂, He, N₂, O₂, noble gas, molecular gas
Microwave power typ. (2.45 GHz) 0.5 to 5 W 0.5 to 5 W 0.5 to 5 W
Maximum Energy 5 kV 15 kV 30 kV
Maximum power beam - - 3 kW
Diameter in vacuum 36,5 mm 62 mm 96 mm
Flange type CF40 CF63 CF63
Cooling None None None
Cable length 2 m

(option: 5m)
2 m

(option: 5m)
2 m

(option: 5m)
Electronics 19" rack mount One or two 19" rack mount Two 19" rack mount
Hardware control Microcontroller Microcontroller Microcontroller
Communication protocol Ethernet UDP, RS232 Ethernet UDP, RS232 Ethernet UDP, RS232
User interface Labview executable
(ethernet UDP only)
Labview executable
(ethernet UDP only)
Labview executable
(ethernet UDP only)
Source gas control Microleak valve or mass flow Microleak valve or mass flow Microleak valve or mass flow

About TES-40

————-
Applications
  • Etching
  • Sputtering
  • Figuring
  • Surface modification & activation
  • Electron chemistry
  • Neutralization
Benefits
  • Stability over time
  • Compactness
  • Reduced maintenance, filament free, no cooling
  • Plug & Play
  • Independent electronics rack, customizable
Options
  • Einzel lens
  • Cable length
Specifications
TES-40 electrons-neutralizer ions-broad beam ions-high brightness
Applications Electron chemistry, neutralization Etching, sputtering, surface activation Etching, figuring, sputtering, surface activation
Energy range 0.1 – 5 kV 0.1 – 5 kV 0.5 – 5 kV
Current 0.1 to 50 mA 0.3 to 3 mA 10 to 500 µA
Beam size (typ. @ 4 cm) 3-30 mm Energy dependent 0.3 to 15mm
Insertion depth 137 mm / 190 mm with Einzel 137 mm 190 mm with Einzel

About TES-63

————-
Applications
  • Etching
  • Sputtering
  • Figuring
  • Mass spectroscopy
  • Accelerator
  • Beam line
  • Electron chemistry
Benefits
  • High brightness system
  • High power e-beam
  • Stability over time
  • Compactness
  • CW or pulsed
  • No maintenance, filament free, no cooling
  • Plug & Play
  • Independent electronics rack
Options
  • Einzel lens
  • Scanner
  • Cable length
Specifications
TES-63 electrons ions ions-high brightness ions-scanner
Applications Electron chemistry (down to 100 V) / High power e-beam up to 1.5 kW Beam line, accelerator, mass spectroscopy, sputtering Beam line, accelerator, mass spectroscopy, etching Etching, Figuring
Energy range 100 V – 15 kV 0.5 – 15 kV 0.5– 15 kV 0.5 – 15 kV
Current 0.1 to 5 µA - typ. with 0.3 mm extractor
10 to 500 µA - typ. with 3 mm extractor
0.3 to 300 µA 10 to 500 µA
Beam size (typ. @ 10 cm from Einzel) Energy and focus dependent 0.3 -30 mm 0.5-5 mm 0.3 to 5mm
Insertion depth from 150 mm or longer on demand from 150 mm or longer on demand 300 mm with Einzel 360 mm with Einzel and scanner

About TES-100

————-
Applications
  • Accelerator
  • Mass spectroscopy
  • Surface modification
  • Electron chemistry
Benefits
  • High brightness system
  • High power e-beam
  • Stability over time
  • CW or pulsed
  • No maintenance, filament free, no cooling
  • Plug & Play CF100
  • Independent electronics rack, customizable
Options
  • Cable length
Specifications
TES-100 electrons ions ions-high stability
Applications Electron chemistry (down to 100 V)
High power e-beam up to 1.5 kW
Accelerator, mass spectroscopy, surface modification Accelerator, mass spectroscopy
Energy range 100 V – 30 kV 5 – 30 kV 0.5 – 30 kV
Energy spread - 1% @30kV 3 10-⁴ @30kV
Current - 3 to 30 µA - typ. with 1 mm extractor
30 to 300 µA - typ. with 3 mm extractor
0.5 to 5 µA - typ. with 0.3 mm extractor
Beam size Energy and focus dependent 0.5 -20 mm 0.5 -3 mm
Insertion depth from 169 mm or longer on demand from 169 mm or longer on demand from 169 mm or longer on demand

A user-friendly control & monitoring software

The source comes with a user-friendly control & monitoring interface, that allows you to control the beam, record data, and run stored recipes. Labview drivers are available to integrate our software with other systems.

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